Design and Analysis of Thermal Expansion in Micro-Electro-Mechanical-System
نویسندگان
چکیده
In this paper, we have design MEMS module based on thermal expansion using COMSOL Multiphysics. This device thermally expands when it is subjected to temperature. Beryllium copper alloy is used as material for this device. The expansion is measured in-terms of displacement.
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